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World’s largest microprocessor maker Intel has said that they have completed the design of its first WiMax baseband chipset for use in laptops and mobile devices.
With this, they are closer than ever to have developed a complete mobile WiMax solution to offer.
Intel said that their new WiMax Connection 2300 combines the new chipset design and the already announced single-chip multi-band WiMax/Wi-Fi radio.
They displayed this at the 3G World Congress and Mobility Marketplace in Hong Kong. Intel showcased a Centrino Duo mobile laptop with mobile WiMax (IEEE 802.16e-2005), Wi-Fi (IEEE 802.11n), and high-speed downlink packet access (HSDPA) 3G capabilities.
Dave Hofer, director of wireless marketing for the mobile platforms group at Intel added about this product: “Our aim with WiMax is to provide personal anytime/anywhere broadband connectivity. This is a step along the way. We’re at a point where, in 2007 and 2008, you’re going to start seeing product samples.”